The grants are part of the RESHAPE initiative.
The Department of Defense (DOD) has granted contracts totaling $49 million to Micross Components and the government of Osceola County, Florida, through the Industrial Base Analysis and Sustainment (IBAS) program. These contracts plan to rejuvenate advanced packaging capabilities and capacity for semiconductors used in defense applications.
“Revitalizing a semiconductor advanced packaging manufacturing ecosystem in the U.S. is critical to enabling the Department’s weapon system development and manufacturing partners across industry to support our warfighters,” said Defense Industrial Base Policy Assistant Secretary Laura Taylor-Kale. “It will also enable lower volume manufacturing commercial markets across the U.S. to advance their products and to assist in sustaining these critical manufacturing capabilities.”
The awarded contracts are part of the Defense Department’s Re-shore Ecosystem for Secure Heterogeneous Advanced Packaged Electronics (RESHAPE). RESHAPE is an advanced packaging manufacturing capability initiative supporting the revitalization of a critical packaging manufacturing ecosystem in the U.S., particularly for the defense industrial base (DIB) and commercial markets.
As the Lord Leads, Pray with Us…
- For Assistant Secretary Taylor-Kale as she oversees the Office of Industrial Base Policy.
- For U.S. Defense Department officials as they support and promote the resilience of the semiconductor supply chain.
Sources: Department of Defense
